July, 2009

This Power-io document is an update to the RoHS document that was previously posted at Power-io.com. New sections have been added at the bottom, along with the date of the new supporting documentation.

This information is applicable to part numbers: HAA-xxxx, HDA-xxxx, HDD-xxxx, DAA-xxxx, DDA-xxxx, IO-Oxx-xxx, and CZ2H-xxxx. Contact Power-io if you have questions about a particular part number.

Environmental Responsibility in Relation to the WEEE and RoHS Directives

Power-io is committed to complying with and, where appropriate, exceeding all Regulatory and Corporate requirements for the Protection of the Environment and the Communities in which we operate. Proactive areas include:

  • Identify, monitor and minimize the impact on the environment associated with the manufacture and use of our products.
  • Design products that minimize the use of resources and can easily be reused, recycles or disposed of in a safe manner.
  • Openly communicate our environmental policy and performance with our suppliers and customers.

EU Directive 2002/95/EC Restriction of Hazardous Substances (RoHS)

Power-io manufactures equipment falling into category 9 (as defined by Annex 1B of EU Directive 2002/96/EC) and we are currently outside the scope of this Directive. We are, however, taking a proactive approach to this legislation by identifying and minimizing the use of any substances covered by the RoHS Directive prior to any legal requirement.

EU Directive 2002/96/EC Waste of Electrical and Electronic Equipment (WEEE)

Power-io is currently evaluating the proposed National Laws and we are reviewing the various methods for compliance. A working Group has been set up to advise on changes to design procedures to make our products more readily reused, recycled or disposed of in a safe and economical manner.

Commission Decision of 21 October, 2005

The Annex to Directive 2002/95/EC is amended to include the use of lead in high melting temperature solders. The use of lead is permitted in these applications. Power-io uses a small quantity of these high temperature solders in some of the products. See: http://www.dti.gov.uk/sustainability/weee/RoHS_Exemptions_October2005.pdf. Even though Power-io is outside the scope of the RoHS directive and is not subject to RoHS, efforts will continue to minimize any substances covered by the RoHS Directive. (As of 2006, the link shown above is no longer active at the DTI web site.)

DTI RoHS Regulations, Government Guidance Notes. June, 2006

The following document summarizes the guidance as on June, 2006: http://www.dti.gov.uk/files/file31606.pdf. In the Annex for exemptions, page 18, Section 7, paragraph 2, the following statement is shown: "The high melting temperature type solder exemption has been introduced to allow the use of lead in solders for specific applications (such as in power semiconductor package manufacturing), for which viable lead-free alternatives have not yet been identified." Please review the entire 27 page document for more information about this topic.

Applications Exemption

In addition to hardware exemption status, there are specific application exemptions. These include: large scale industrial tool applications, national security applications, military applications, and other applications. The DTI document provides a flow chart to assist with these topics. Visit: http://www.dti.gov.uk/files/file31606.pdf

DTI RoHS Regulations, Government Guidance Notes. Jan, 2007

The following document summarizes the guidance as on January, 2007: http://www.dti.gov.uk/files/file37219.pdf. In the Annex for exemptions, page 18, Section 7, paragraph 2, the following statement is shown: "The high melting temperature type solder exemption has been introduced to allow the use of lead in solders for specific applications (such as in power semiconductor package manufacturing), for which viable lead-free alternatives have not yet been identified." Please review the entire 27 page document for more information about this topic.

BERR RoHS Regulations, Government Guidance Notes. Oct, 2008

The following document summarizes the guidance as of July, 2008: BERR Dept for Business Enterprise & Regulatory Reform -- RoHS Regulations: Government Guidance Notes. In the Annex for exemptions, page 19, Section 7, paragraph 2, the following statement is shown: "The high melting temperature type solder exemption has been introduced to allow the use of lead in solders for specific applications (such as in power semiconductor package manufacturing), for which viable lead-free alternatives have not yet been identified." Please review the entire 32 page document for more information about this topic.

Europa, EUR-Lex search engine. July, 2009

The following link connects you to the latest directive updates: